IRIS Data Center Development
A phased 710 MW AI data center campus development plan across IRIS 1-11 in Most, Czechia.
Modular Architecture
Phased Development Plan
Technical Blueprints
Built for High-Density Workloads
Our physical footprint provides structural layouts built to comfortably manage heavy industrial configurations and advanced system density loads across multiple server tiers seamlessly.
Core Value Proposition
Market Overspill Solution
Location
Most, Czechia
To German Border
20 km
To Prague
85 km
Target Markets
Frankfurt & Leipzig overflow
Demand-Linked Growth
Deployment Model
Demand-linked activation
Trigger
Phased by tenant commitment
Speculative Risk
Eliminated
Carrying Costs
Zero speculative exposure
Ultra-Low Latency Topology
Max Latency
Sub-5 ms to major IXPs
To Prague
1.3 ms
To Leipzig
1.8 ms
To Frankfurt
4.2 ms
Technical Substation Architecture
grid connection & power architecture
A campus built at hyperscale
2N GIS Substation
Compact, weather-sealed 110/35 kV GIS substation with a 4,000 A double busbar configuration and full 2N path separation, eliminating single points of failure across the campus.
tri-feeder grid diversity
Powered by one 110 kV transmission line from CEZ and two 400 kV transmission lines from Pocerady, providing Tri-Feeder grid diversity and resilient utility connectivity.
dynamic load segregation
Infrastructure cleanly separates customer zones to scale effortlessly from standard hyperscale deployments to the IRIS 3 high-density deployment, where rack densities of up to 14 kW/sqm are supported.
Sovereign Eco-Performance
Water Usage Effectiveness
IRIS 1 achieves a Water Usage Effectiveness (WUE) of 0.00 through no adiabatic cooling and AHU-only humidification, delivering efficient thermal management with minimal water consumption.
This completely insulates international operators and ESG-focused infrastructure funds from regional water scarcity risks.
Sustainability & Mechanical Innovation
the hybrid cooling matrix
To manage the vast thermal output of high-performance GPU arrays, IRIS pairs high-temperature direct liquid cooling (DLC) chip loops with ambient chilled water fan wall systems. Every loop is built for concurrent, multi-tier maintenance, ensuring continuous uptime.
Campus PUE Target
1.24–1.30
IRIS 1 WUE
0.00
Cooling Type (IRIS 3 / KONNECT)
80% DLC
Secondary Cooling (IRIS 3 / KONNECT)
20% RDHx
Investor Resources
development deck
A campus built at hyperscale
Phasing
IRIS AI campus
IRIS Data Center Campus · Bluesio Technologies 2026
710 MW Development Deck
Document Type
Development Deck
Format
PDF · 40 Slides
Coverage
Full Campus AI Phases
Issued
April 2026
Let’s Build The Future Of AI Together
Join us in building Europe’s most advanced AI and cloud infrastructure campus.
